With the development of many electronic products to small, light, high-density direction, especially the extensive use of handheld devices, in terms of component materials and processes, the originalSMTtechnology presents serious challenges, and therefore makesSMThe opportunity for rapid development.lCPin Pitch Development0.5mm、0.4mm、0.3mm，BGAhas been widely adopted,CSPAlso emerging, and showing a rapid upward trend, the material on the cleaning-free, low residue solder paste is widely used. All of these have put forward new requirements for the reflow soldering process. The trend is to use a more advanced heat transfer method for reflow soldering to achieve energy saving, uniform temperature, and suitable for double-sided boards.PCBAnd the welding requirements of the new device packaging method, and gradually realize the comprehensive replacement of wave soldering. Generally speaking, the reflow furnace is developing in the direction of high efficiency, multi-function and intelligence.

Reflow soldering technology is not unfamiliar in the field of electronic manufacturing, weComputerThe components on various boards used in the device are welded to the circuit board through this process. There is a heating circuit inside the device, which heats air or nitrogen to a high enough temperature and then blows it to the circuit board on which the components have been pasted, so that the components on both sides ofSolderMelt after bonding with the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and the manufacturing cost is easier to control.

The welding process can also avoid oxidation in general useinert gasProtection has been in use for a long time and has been widely used. Due to price considerations, nitrogen protection is generally selected. In order to ensure the welding quality of electronic products under high temperature conditions, it is necessary to strictly control the oxygen content in reflow soldering and wave soldering equipment, which requires the use of test ranges from air (20.95%) to a low oxygen concentration environment (5ppmLeft and right) full coverage of the oxygen sensor to monitor the oxygen content in the furnace, so as to improve the process, improve product quality.

Technology Fluorescent Micro Oxygen ModuleLOX-TRACEIt can work at any oxygen concentration without damaging the sensor. sensor high precision, high resolution zui high1PPM. The traditional electrochemical is not easy to save, zirconia overrange use will be damaged. Oxygen concentration in reflow soldering needs to be from constant20.9%Down5PPMAround, the fluorescent micro-oxygen module can be described as a benefit.